hisilicon-opensdk: wire up CV300 open_ modules into firmware#2014
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hisilicon-opensdk: wire up CV300 open_ modules into firmware#2014
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Add hi3516cv300 (V3) support — last platform. CV300 has OSAL (source-compiled) like CV500/3519v101, so zero openhisilicon code changes were needed. Key details: - Kernel 3.18.20 (same as 3519v101) - Blob prefix: hi3516cv300_* (used for both blobs AND source drivers) - Source drivers (pwm, wdt, ir, rtc) use hi3516cv300_ prefix unlike 3519v101 which uses hi_* - Vendor ships combined hi3516cv300_sensor.ko; we install sensor_i2c as that name (SPI bus symbols are weak deps, I2C sensors work fine) - 38 modules installed, image fits lite flash (4524KB < 5120KB) Also enables opensdk for hi3516ev100 (same SOC_FAMILY=hi3516cv300). Co-Authored-By: Claude Opus 4.6 (1M context) <noreply@anthropic.com>
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Summary
Add hi3516cv300 (V3) — the last platform. All 8 HiSilicon chip families now have open_ modules wired into firmware.
CV300 has OSAL (source-compiled) like CV500/3519v101. One openhisilicon fix needed: EXPORT_SYMBOL for sensor_spi functions (openhisilicon#59).
/lib/modules/3.18.20/hisilicon/hi3516cv300_*(also used for source drivers)Depends on openhisilicon#59 for sensor_spi symbol exports.
All platforms complete
Test plan
make BOARD=hi3516cv300_lite allbuilds (4524KB < 5120KB)🤖 Generated with Claude Code